Solderability testing equipment solderability test. Wetting balance test of a component lead, which is plated in both side, but not in the cut surface. A specification sample is mounted within the titanium holder. Bga solderability testing for analysis per jstd002c test s 4. Table 33 solderability test selection component type. Jstd002 solderability tests for component leads, terminations, lugs, terminals and wires is the defining standard prescribing test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. Eiaipcjedec jstd 002e solderability tests for component leads, terminations, lugs, terminals and wires a joint standard developed by ipc component and wire solderability speci. Enter your mobile number or email address below and well send you a link to download the free kindle app. The cover is designed so that steam is condensed and channeled to the side. Steam is always safely vented and safety features prevent leakage, over temp and insufficient steam. Association connecting electronics industries solderability.
Solderability tests for component leads, terminations, lugs. This document comes with our free notification service, good for the life of the document. Download free j std 002d solderability tests for component leadsalso included in the standard. When ipca610 is used as a companion document to j std 001, the revisions of j std 001 and ipca610 should corres pond, e. Ipceiajstd002 solderability tests for component leads, terminations, lugs, terminals and wires. Aug 24, 2012 wetting balance test of a component lead, which is plated in both side, but not in the cut surface. Solderability varies depending on the type of solder alloy under discussion and when using lead free alloys can differ significantly from solderability when using lead based alloys. Ipceca jstd002 solderability tests for component leads, terminations, lugs, terminals and wires. The new revision is a step forward in this regards and can be pre.
Photon steam aging system solderability test systems rps. This standard also includes a test method for the resistance to dissolutiondewetting of metallization. The new j std 002d, solderability tests for component. Solderability tests for component leads, terminations. The discussion that follows applies only to unspecified electronic solders which may include solders that contain lead, now banned for use in nearly all electronic equipment made or sold in the eu. In its place, jedecs test method, jesd22b102, solderability, which includes lead free, was made available until it was replaced by jstd. Here are some quick and easy test approaches that have proven useful for basic troubleshooting. If the joints look good, but there is still doubt, have a testing lab do an xray to determine copper content of the solder or other potential causes of poor solderability.
Ansiipc a610d solderability tests for component leads, terminations, lugs, terminals and wires, includes amendment 1 november 2008 this product replaces. When ipca610 or other related documents ar e cited along with ipc j std 001 the order of precedence shall d1d2d3 be defined in the procurement documents. Solder alloys test lead and lead free solder duration. At act, a typical sample of three devices or 15 leads are preconditioned steam aged prior to testing. Ipcjstd002e is intended for use by both supplier and. Hot dip and look examined for evidence of porosity, voids, coverage, inconsistent wetting, etc. Jstd 002b february 2003 jstd 002a october 1998 jstd 002 april 1992. Solderability tester must that grandfathered all modern solderability test standards. Test e1 wetting balance solder pot test leaded components lead free solder paragraph 4. It remains the unquestioned industry benchmark for solderability testing and test systems. Jstd002b february 2003 jstd002a october 1998 jstd002 april 1992 association connecting electronics industries. Ipc jstd002b solderability tests for component leads, terminations, lugs, terminals and wires inactive. Ipc jstd002d solderability tests for component leads. The sample is mounted in a purpose made clamp while in.
Jstd003a standard 2003 solderability tests for printed boards. Ipceiajedec jstd002b solderability tests for component leads, terminations, lugs, terminals and wires a joint standard developed by the eca soldering technology committee stc, the component and wire solderability speci. Accelerated ageing and solderability test of tin plated components. Ansiipc jstd002b solderability tests for component leads, terminations, lugs, terminals and wires browse product family. The ipcjstd002e standard also includes a test method for the resistance to dissolutiondewetting of metallization. At the request of ipc, jstd 002b has been removed from the free download area. When ipca610 is used as a companion document to jstd001, the revisions of jstd001 and ipca610 should corres pond, e. Jstd003 solderability tests for printed boards is the defining standard prescribing test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and platedthrough holes utilizing either tinlead or lead free solders. The unit automatically shuts down at the end of the preprogrammed cycle. This standard is intended for use by both supplier and user. Solderability tests for component leads, terminations, lugs, terminals and wires 1 preface 1. This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. Bga solderability testing for analysis per jstd002c test s. Ipc jstd 002e prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs.
Solderability testing, utilizing wetting balance technology, is a measurement of the weight and speed with which the solder meniscus climbs upwards on the component lead dipped in molten solder. At the request of ipc, jstd002b has been removed from the free download area. J std 002d archives document centers standards forum. Ipcjedec jstd002 solderability tests for components leads, terminations, lugs, terminals, and wires.
In its place, jedecs test method, jesd22b102, solderability, which includes lead free, was made available until it was replaced by jstd002d. Ipc jstd003cwam1 solderability tests for printed boards. The vertical dip function performs the tests described in iec 68220 test ta and ansijstd003 4. Understanding solderability testing for printed circuit. Oct 17, 2012 in the world of electronic assembly and componentprinted wiring board fabrication, there is no greater mandate than to develop lead free technology. The rotary solderability test is designed to perform in accordance with iec 68220 test tc and ansijstd003 4. Jul 22, 20 so it is with great anticipation that the new jstd002 revision d, solderability tests for component leads, terminations, lugs, terminals and wires, is welcomed into the world. Six sigma always considers the test to be destructive.
Iec 60068220 and 60068258 ipceiajedec jstd002b ipceia jstd003a solderability testers meniscus v automatic test report v meniscus angle vs std nf899400 v force in mn vs std iec 600068269. When properly administered wetting balance measurement is by far the most accurate, quantitative method for measuring, testing and recording solderability. The j standard requires steam aging as a component of the solderability test process. The new revision is a step forward in this regards and can be preordered now from document center inc. If solderability is in doubt, a simple test is to stencil solder paste on a bare board and then reflow it without components. Wetting balance testing to all prevailing test standards. The contractual agreements statement in jstd002 shall.
Intended for use by both vendors and users, jstd002d was developed by eia, ipc and jedec. Solderability tests for component leads, terminations, lugs, terminals and wires. You can see how much better the solderability is on plate. The solderability test shall be performed in accordance with ipceia jstd002 current revision solderability tests for component leads, terminations, lugs terminals and wires, and herein. When ipca610 or other related documents ar e cited along with ipc jstd001 the order of precedence shall d1d2d3 be defined in the procurement documents. So it is with great anticipation that the new jstd002 revision d, solderability tests for component leads, terminations, lugs, terminals and wires, is welcomed into the world. In these tests, the packages are aged, in order to test the solderability under the worst conditions and to warrant at least 2 years of storage with no significant degradation of solderability. Eiaipcjedec jstd002e solderability tests for component leads, terminations, lugs, terminals and wires a joint standard developed by ipc component and wire solderability speci.
Solder composition range % weight lead free tin 94. In its place, jedecs test method, jesd22b102, solderability, which includes leadfree, was made available until it was replaced by jstd002d. Find the most uptodate version of ipceca jstd002 at engineering360. February 1, 2003 solderability tests for component leads, terminations, lugs, terminals and wires. Ansiipc j std 002b solderability tests for component leads, terminations, lugs, terminals and wires browse product family. Samples will be tested in accordance with jstd002d method. Surface mount process simulation test pb free solder 4. Component leads, terminations, lugs, terminals and wires. Ipceca jstd002 solderability tests for component leads. This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wire, stranded wire, lugs, and tabs.
Ipc jstd002d solderability tests for component leads, terminations, lugs, terminals and wires ipc on. Edge dip, wave solder, surface mount simulation, and wetting balance testing can be used for both tinlead snpb and sac 305 alloys. After the aging process, the components are brought to the prelude for solderability testing and, if successful, certification for longterm storage. Ipc jstd002b solderability tests for component leads. Ipc jstd002e solderability tests for component leads, terminations, lugs, terminals and wires. Ipc jstd002d solderability tests for component leads, terminations, lugs, terminals and wires. The ipc jstd 002e standard also includes a test method for the resistance to dissolutiondewetting of metallization. Learn vocabulary, terms, and more with flashcards, games, and other study tools. Any revision to jstd002 will no longer be available for free to the industry on the jedec website.
Advanced component testing can perform solderability tests on leaded and lead free components in accordance with milstd883 method 2003 as per our iso 17025 certification, milstd202 method 208h and jstd 002b. Appendix f jstd002jstd003 activated solderability test. Ipc jstd 002e is intended for use by both supplier and. Bga solderability testing for analysis per jstd002c test. Solderability testing equipment solderability test systems.
Solderability when using lead free alloys can differ significantly from solderability when using lead based. Jstd002b standard 2003 solderability tests for component leads, terminations, lugs, terminals and wires. This standard is intended for use by both vendor and user. This standard describes test methods by which the surface conductors, attachment lands, and pths may be evaluated for solderability. Other pb free alloys may be used for testing aabus. A simple and fast test for determining pad solderability on bare boards if solderability is in doubt, a simple test is to. The new j std 002d, solderability tests for component leads. Find the most uptodate version of jstd002b at engineering360. Jstd003c prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and platedthrough holes utilizing either tinlead or lead free solders.
Solderability varies depending on the type of solder alloy under discussion. Appendix f jstd 002 jstd 003 activated solderability test flux rationale committee letter. Ipcjstd002e prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. It remains the unquestioned industry benchmark for solderability. Download free j std 002d solderability tests for component leads solderability testing milstd 883 jstd 002 oneida. In the world of electronic assembly and componentprinted wiring board fabrication, there is no greater mandate than to develop lead free technology. Ipceiajstd002 revision e current show complete document history. Developments in standards for lead free soldering are not complete and are progressing with new. Solderability testing of electronic components for surface mounting devices smd by the wetting.
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